Nanya Technology lays out wafer-level packaging and testing and will invest in setting up a factory in Pingtung Science Park南亚科技布局晶圆级封测，将在屏东科学园区投资设厂
IT House reported on October 5 that Nanya Technology, a manufacturer of DRAM memory chips and modules, announced on the 1st of this month that it would invest in setting up a 3D wafer packaging and testing factory in Pingtung Science Park. This advanced packaging and testing facility will introduce TSV (Through Silicon Via)...
IT之家 10 月 5 日消息，DRAM 内存芯片与模组制造商南亚科技 (Nanya Technology) 本月 1 日宣布，将在屏东科学园区投资设立 3D 晶圆封装测试厂。 这座先进封测设施将导入 TSV（硅通孔）…
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IT House reported on October 5 that Nanya Technology, a manufacturer of DRAM memory chips and modules, announced on the 1st of this month that it would invest in setting up a 3D wafer packaging and testing factory in Pingtung Science Park. This advanced packaging and testing facility will introduce advanced 3D IC technologies such as TSV (Through Silicon Via) and wafer stacking, and lay out professional manufacturing integration capabilities for wafer level (Wafer Level) packaging and testing to meet the high-performance, high-bandwidth memory requirements driven by the rapid development of AI applications. IT House noted that judging from the description, Nanya Technology’s new back-end factory will target “HBM-like” memory solutions and is expected to win orders for various AI chips.
IT之家 10 月 5 日消息，DRAM 内存芯片与模组制造商南亚科技 (Nanya Technology) 本月 1 日宣布，将在屏东科学园区投资设立 3D 晶圆封装测试厂。 这座先进封测设施将导入 TSV（硅通孔）、晶圆堆叠等 3D IC 先进技术， 布局晶圆级 (Wafer Level) 封装与测试的专业制造整合能力 ，以满足 AI 应用快速发展所带动的高性能、高带宽内存需求。 IT之家注意到，从描述上来看，南亚科技的这种新后端工厂 将瞄准“类 HBM”的内存解决方案 ，有望拿下各类 AI 芯片的订单。
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