Huawei’s Xu Songyu: Kirin 9050 series kicks off a new decade, brings the industry’s first 30B MoE model on-device | 华为徐松余：麒麟 9050 系列开启未来 10 年新征程，实现业界首个 30B MoE 大模型入端

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At Huawei’s 2026 Kirin media briefing in Shanghai on 13 October, Xu Songyu, head of wireless terminal chip product management in Huawei’s semiconductor business, spoke about the company’s latest logic-folding roadmap. Applied for the first time in the Kirin 9050 series, it delivered solid gains in performance and efficiency. Xu described the Kirin 9050 series as the first logic-folded chip to open a new ten-year journey, with slides showing a target of passing 5GHz on P-cores by 2031. On AI, the Kirin 9050 series is Kirin’s first native AI Phone platform: the Kirin 9050 Pro packs a new-generation Da Vinci NPU and Lingxi micro-cores, lifting AI performance by 140% while cutting power by 66%. The series brings the industry’s first 30B MoE model on-device — 30B total parameters, 2B active, using under 2.5GB of memory — alongside 7B dense and 1B VLM models to serve different AI scenarios.

中文

IT之家 10 月 13 日现场消息，华为今日（10 月 13 日）在上海练秋湖举办 2026 麒麟媒体沟通会，华为半导体业务无线终端芯片产品管理部部长徐松余发表演讲。徐松余谈到了华为最新的韬定律和逻辑折叠路线，韬定律首次应用于麒麟 9050 系列，在性能 / 能效上获得了可观的收益。徐松余表示，麒麟 9050 系列作为首款逻辑折叠的韬芯片，开启未来 10 年新征程。从 PPT 可以看到，华为目标在 2031 年实现 P 核频率突破 5GHz。 IT之家在沟通会现场获悉，麒麟 9050 系列在 AI 方面也取得了进步，是麒麟首个原生 AI Phone 平台。麒麟 9050 Pro 搭载新一代达芬奇架构 NPU、灵犀微核，AI 性能提升 140%、功耗降低 66%。麒麟 9050 系列实现业界首个 30B MoE 大模型入端，总参数 30B、激活参数 2B，占用内存不到 2.5G；还有 7B Dense 大模型、1B VLM 模型等加持，满足不同功能场景下的 AI 需求。

Huawei’s Xu Songyu: Kirin 9050 series kicks off a new decade, brings the industry’s first 30B MoE model on-device华为徐松余：麒麟 9050 系列开启未来 10 年新征程，实现业界首个 30B MoE 大模型入端

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Huawei’s Xu Songyu: Kirin 9050 series kicks off a new decade, brings the industry’s first 30B MoE model on-device华为徐松余：麒麟 9050 系列开启未来 10 年新征程，实现业界首个 30B MoE 大模型入端

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